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  1. Giriş /
  2. Gömülü Bilişim Sistemleri /
  3. Bilgisayar Açık Modülleri /
  4. COM-HPC /
  5. Extension /

Extension

SOM-E780

AMD EPYC™ 7003 COM-HPC® Server Size E module with proprietary pinout

  • COM-HPC® Server Size E module with proprietary pinout
  • Up to 64C/225W AMD EYPC™ 7003 real server grade CPU with extreme performance
  • Up to 512GB large memory size with 4x DDR4 long DIMM
  • 79 PCIe Gen4 lanes (14 more than COM-HPC STD)
  • Supports iManager, Embedded Software APIs, WISE-DeviceOn, and IPMB

Support Links:

Datasheet Teknik İndirmeler
  • AMD EPYC™ 7003 COM-HPC® Server Size E module with proprietary pinout

Specifications

Form Factor
Form Factor
  • COM-HPC Size E
Pin-out Type
  • COM-HPC Server
Processor
CPU
  • AMD EPYC™ 7313P
Core Number
  • 16
Thread
  • 32
Base Frequency
  • 3.0 GHz
Max Turbo Frequency
  • 3.7 GHz
CPU TDP
  • 155W
BIOS
  • AMI UEFI 128 Mbit
Memory
Technology
  • DDR4 3200 MHz
Socket
  • 4 x LRDIMM
Max. Capacity
  • 512GB
ECC Support
  • Yes
Expansion
PCI Express x 16
  • 4
PCI Express x 1
  • 14
Serial Bus
SMBus
  • Yes
I2 C Bus
  • Yes
Ethernet
Controller
  • intel I225
Speed
  • 10/100/1000/2500 Mbps
Storage
SATA
  • 2 x SATAIII
I/O
USB 3.2
  • 4
USB2.0
  • 4
SPI Bus
  • 1
GPIO
  • 12
LPC
  • 1
Watchdog timer
  • 65536 level, 0 ~ 65535 sec
COM Port
  • 2
TPM
  • TPM 2.0
Smart Fan
  • 2 Ports; 1 Port on COM Module. Support 12V Fan, 1 Port on Carrier Board
Power
Power Type
  • ATX: Vin, VSB; AT: Vin
Power Supply Voltage
  • Vin: 12V (± 5%); VSB: 5V (± 5%), RTC Battery: 2.0V ~ 3.3V
Environment
Operating Temperature
  • 0 ~ 60° C (32 ~ 140° F)
Storage Temperature
  • 0 ~ 60℃
Humidity
  • Operating: 40° C @ 95% relative humidity, non-condensing; Storage: 60° C @ 95%relative humidity, non-condensing
Vibration Resistance
  • 3.5 Grms
Mechanical
Dimensions
  • 200 x 160 mm

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