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Server Boards

ASMB-808

Intel® Xeon® W Processors CEB Server Board with 8 x DDR5, 7 x PCIe x16 for Optimized design for Max 3-4 dual-slot GPU support .

  • LGA4710 CEB server board with Intel Xeon® GNR-W 690/670/650/630 series, TDP up to 350W
  • DDR5 6400 MHz RDIMM up to 2TB (8 DIMMs), also supports MRDIMM
  • 7 x PCIe x16 (Gen5)
  • Intel® X710 dual 10GbE ports
  • 8 x SATA 3(via 2 x SlimSAS) and 2 x M.2 connectors (PCIe x4)
  • 7 x USB 3.2 Gen1 (5 on Rear, 2 via internal header), 1 x USB 3.2 Gen2 (Type E-key), 1 x USB 3.2 Gen2x2 Type-C, 3 x USB 2.0 (1 Type-A, 2 via internal header)
  • 0 ~ 60°C (32 ~ 140°F) ambient operating temperature range

Certifications:

Specifications

Processor System
CPU
  • Intel® Xeon® GNR-W 690/670/650/630 processor
Socket Q'ty
  • 1 x LGA4710
TDP
  • Up to 350 W
Memory
Type and Speed
  • DDR5 6400 MHz ECC-REG RDIMM ; supports MRDIMM
Channel
  • 8
System Max Capacity
  • 2 TB
Expansion
PCIe/PCI Module
  • 7 x PCIe 5.0 x16
MCIO
  • 2 x PCIe 5.0 x8, CXL support
Internal Storage
M.2
  • 2 x M.2 2280 M-Key (PCIe Gen4 x4)
Rear I/O
Display
  • 1 x VGA port
USB
  • 5 x USB 3.2 Gen1, 1 x USB 3.2 Gen2x2 Type-C
LAN
Controller
  • Intel® I226LM, Intel® E610
2.5GbE
  • 2
10GbE
  • 2
Security
TPM
  • TPM 2.0 onboard
Storage
SATA Port
  • 8 x SATA 3.0 (6 Gb/s) via 2 x SlimSAS
Cooling
System Fan
  • 6 x system, 1 x CPU
System Management
Controller
  • Aspeed AST2600
IPMI
  • Advantech remote monitoring utility
Watchdog Timer
Output
  • System Reset
Environment
Operating Temperature
  • 0 ~ 60 °C, depends on CPU speed and cooler solution
Non-Operating Temperature
  • -40 ~ 85 °C (-40 ~ 185 °F)
Operating Humidity
  • 95% @ 40 °C, non-condensing
Non-Operating Humidity
  • 10 ~ 95% @ 60 °C, non-condensing
Physical Characteristics
Form Factor
  • CEB
Dimensions (L x H)
  • 304.8 x 266.7 mm (12" x 10.5")
Certification
EMC
  • CE/FCC