마이어드밴텍 가입

마이어드밴텍은 어드밴텍 고객을 위한 맞춤 포털 사이트입니다. 어드밴텍의 멤버가 되시면, 최근 제품정보, 웨비나 초대, 최신 할인/사은품 정보를 구독하실 수 있습니다.

바로 회원가입하시고 365일 언제라도 접속 가능한 맞춤 최신 정보를 확인하세요.

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Panel Button
  1. 홈 /
  2. 임베디드 컴퓨터 /
  3. 컴퓨터 온 모듈 (COM) /
  4. COM-HPC /
  5. 서버 /

서버

SOM-D580

인텔® 제온® D-2700 프로세서 (아이스 레이크-D HCC) COM-HPC® 서버 사이즈 D 모듈

  • COM-HPC® 서버 사이즈 D 모듈
  • 인텔® 제온® D-2700 프로세서
  • 최대 20코어, 30MB LLC 캐시, 118W TDP
  • 최대 512GB의 쿼드 채널 DDR4-3200 RDIMM/LRDIMM(ECC 및 Non-ECC)
  • PCIe Gen 4 32개, PCIe Gen 3 17개, 25GBASE-KR 4개, IPMB 지원
  • iManager, 임베디드 소프트웨어 API 및 WISE-DeviceOn 지원

지원 링크:

데이터시트 기술자료다운로드
  • 인텔® 제온® D-2700 프로세서 (아이스 레이크-D HCC) COM-HPC® 서버 사이즈 D 모듈

사양

Form Factor
Form Factor
  • COM-HPC® Size D
  • COM-HPC® Size D
  • COM-HPC® Size D
  • COM-HPC® Size D
  • COM-HPC® Size D
  • COM-HPC® Size D
  • COM-HPC® Size D
  • COM-HPC® Size D
Pin-out Type
  • COM-HPC Server
  • COM-HPC Server
  • COM-HPC Server
  • COM-HPC Server
  • COM-HPC Server
  • COM-HPC Server
  • COM-HPC Server
  • COM-HPC Server
Processor
CPU
  • Intel D-2796TE
  • Intel D-2775TE
  • Intel D-2752TER
  • Intel D-2733NT
  • Intel D-2712T
  • Intel D-2796TE
  • Intel D-2775TE
  • Intel D-2752TER
Frequency
  • 2.0 GHz
  • 2.0 GHz
  • 1.80 GHz
  • 2.1 GHz
  • 1.9 GHz
  • 2.0 GHz
  • 2.0 GHz
  • 1.8 GHz
Max Turbo Frequency
  • 3.1 GHz
  • 3.1 GHz
  • 2.8 GHz
  • 3.2 GHz
  • 3.0GHz
  • 3.1 GHz
  • 3.1 GHz
  • 2.8 GHz
Core Number
  • 20
  • 16
  • 12
  • 8
  • 4
  • 20
  • 16
  • 12
LLC
  • 30MB
  • 25MB
  • 20MB
  • 15MB
  • 15MB
  • 30MB
  • 25MB
  • 20MB
TDP
  • 118W
  • 100W
  • 77W
  • 80W
  • 65W
  • 118W
  • 100W
  • 77W
BIOS
  • AMI UEFI 256 Mbit
  • AMI UEFI 256 Mbit
  • AMI UEFI 256 Mbit
  • AMI UEFI 256 Mbit
  • AMI UEFI 256 Mbit
  • AMI UEFI 256 Mbit
  • AMI UEFI 256 Mbit
  • AMI UEFI 256 Mbit
Memory
Technology
  • DDR4
  • DDR4
  • DDR4
  • DDR4
  • DDR4
  • DDR4
  • DDR4
  • DDR4
ECC Support
  • Yes
  • Yes
  • Yes
  • Yes
  • Yes
  • Yes
  • Yes
  • Yes
Max. Capacity
  • 512GB
  • 512GB
  • 512GB
  • 512GB
  • 512GB
  • 512GB
  • 512GB
  • 512GB
Socket
  • 4 x RDIMM, 1 DPC, 3200 MT/s, max DIMM capacity 64GB, up to 256GB
  • 4 x RDIMM, 1 DPC, 3200 MT/s, max DIMM capacity 64GB, up to 256GB
  • 4 x RDIMM, 1 DPC, 3200 MT/s, max DIMM capacity 64GB, up to 256GB
  • 4 x RDIMM, 1 DPC, 3200 MT/s, max DIMM capacity 64GB, up to 256GB
  • 4 x RDIMM, 1 DPC, 3200 MT/s, max DIMM capacity 64GB, up to 256GB
  • 4 x RDIMM, 1 DPC, 3200 MT/s, max DIMM capacity 64GB, up to 256GB
  • 4 x RDIMM, 1 DPC, 3200 MT/s, max DIMM capacity 64GB, up to 256GB
  • 4 x RDIMM, 1 DPC, 3200 MT/s, max DIMM capacity 64GB, up to 256GB
Expansion
PCI Express
  • 32 x PCIe Gen 4 and 17 x PCIe Gen 3 (1port PCIe x1 Gen3 for BMC), total 49 lanes
  • 32 x PCIe Gen 4 and 17 x PCIe Gen 3 (1port PCIe x1 Gen3 for BMC), total 49 lanes
  • 32 x PCIe Gen 4 and 17 x PCIe Gen 3 (1port PCIe x1 Gen3 for BMC), total 49 lanes
  • 32 x PCIe Gen 4 and 17 x PCIe Gen 3 (1port PCIe x1 Gen3 for BMC), total 49 lanes
  • 32 x PCIe Gen 4 and 17 x PCIe Gen 3 (1port PCIe x1 Gen3 for BMC), total 49 lanes
  • 32 x PCIe Gen 4 and 17 x PCIe Gen 3 (1port PCIe x1 Gen3 for BMC), total 49 lanes
  • 32 x PCIe Gen 4 and 17 x PCIe Gen 3 (1port PCIe x1 Gen3 for BMC), total 49 lanes
  • 32 x PCIe Gen 4 and 17 x PCIe Gen 3 (1port PCIe x1 Gen3 for BMC), total 49 lanes
SMBus
  • Yes
  • Yes
  • Yes
  • Yes
  • Yes
  • Yes
  • Yes
  • Yes
Serial Bus
SMBus
  • Yes
  • Yes
  • Yes
  • Yes
  • Yes
  • Yes
  • Yes
  • Yes
I2 C Bus
  • X2
  • X2
  • X2
  • X2
  • X2
  • X2
  • X2
  • X2
Ethernet
Ethernet KR
  • Intel Integrated 4x 10G or 4x 25G (depands on SoC SKU)
  • Intel Integrated 4x 10G or 4x 25G (depands on SoC SKU)
  • Intel Integrated 4x 10G or 4x 25G (depands on SoC SKU)
  • Intel Integrated 4x 10G or 4x 25G (depands on SoC SKU)
  • Intel Integrated 4x 10G or 4x 25G (depands on SoC SKU)
  • Intel Integrated 4x 10G or 4x 25G (depands on SoC SKU)
  • Intel Integrated 4x 10G or 4x 25G (depands on SoC SKU)
  • Intel Integrated 4x 10G or 4x 25G (depands on SoC SKU)
Gigabit
  • Intel I225IT Controller; 10M/100M/1000M/2.5Gbps
  • Intel I225IT Controller; 10M/100M/1000M/2.5Gbps
  • Intel I225IT Controller; 10M/100M/1000M/2.5Gbps
  • Intel I225IT Controller; 10M/100M/1000M/2.5Gbps
  • Intel I225IT Controller; 10M/100M/1000M/2.5Gbps
  • Intel I225IT Controller; 10M/100M/1000M/2.5Gbps
  • Intel I225IT Controller; 10M/100M/1000M/2.5Gbps
  • Intel I225IT Controller; 10M/100M/1000M/2.5Gbps
I/O
SATA 3.0
  • 2 Ports
  • 2 Ports
  • 2 Ports
  • 2 Ports
  • 2 Ports
  • 2 Ports
  • 2 Ports
  • 2 Ports
USB 3.2
  • 4
  • 4
  • 4
  • 4
  • 4
  • 4
  • 4
  • 4
USB2.0
  • 4
  • 4
  • 4
  • 4
  • 4
  • 4
  • 4
  • 4
SPI Bus
  • Yes
  • Yes
  • Yes
  • Yes
  • Yes
  • Yes
  • Yes
  • Yes
GPIO
  • 12 GPIO Ports
  • 12 GPIO Ports
  • 12 GPIO Ports
  • 12 GPIO Ports
  • 12 GPIO Ports
  • 12 GPIO Ports
  • 12 GPIO Ports
  • 12 GPIO Ports
eSPI
  • Yes
  • Yes
  • Yes
  • Yes
  • Yes
  • Yes
  • Yes
  • Yes
Watchdog timer
  • 65536 level, 0 ~ 65535 sec
  • 65536 level, 0 ~ 65535 sec
  • 65536 level, 0 ~ 65535 sec
  • 65536 level, 0 ~ 65535 sec
  • 65536 level, 0 ~ 65535 sec
  • 65536 level, 0 ~ 65535 sec
  • 65536 level, 0 ~ 65535 sec
  • 65536 level, 0 ~ 65535 sec
COM Port
  • 2 Ports (4-Wire)
  • 2 Ports (4-Wire)
  • 2 Ports (4-Wire)
  • 2 Ports (4-Wire)
  • 2 Ports (4-Wire)
  • 2 Ports (4-Wire)
  • 2 Ports (4-Wire)
  • 2 Ports (4-Wire)
TPM
  • TPM 2.0
  • TPM 2.0
  • TPM 2.0
  • TPM 2.0
  • TPM 2.0
  • TPM 2.0
  • TPM 2.0
  • TPM 2.0
Smart Fan
  • 2 Ports: 1 port on COM module (4 pins); 1 port on carrier board (3 pins)
  • 2 Ports: 1 port on COM module (4 pins); 1 port on carrier board (3 pins)
  • 2 Ports: 1 port on COM module (4 pins); 1 port on carrier board (3 pins)
  • 2 Ports: 1 port on COM module (4 pins); 1 port on carrier board (3 pins)
  • 2 Ports: 1 port on COM module (4 pins); 1 port on carrier board (3 pins)
  • 2 Ports: 1 port on COM module (4 pins); 1 port on carrier board (3 pins)
  • 2 Ports: 1 port on COM module (4 pins); 1 port on carrier board (3 pins)
  • 2 Ports: 1 port on COM module (4 pins); 1 port on carrier board (3 pins)
Power
Type
  • ATX: Vin, VSB; AT: Vin
  • ATX: Vin, VSB; AT: Vin
  • ATX: Vin, VSB; AT: Vin
  • ATX: Vin, VSB; AT: Vin
  • ATX: Vin, VSB; AT: Vin
  • ATX: Vin, VSB; AT: Vin
  • ATX: Vin, VSB; AT: Vin
  • ATX: Vin, VSB; AT: Vin
Power Consumption (Max)
  • 178.11W@12V (D-2796TE with 512GB LRDDR4 3200)
  • 178.11W@12V (D-2796TE with 512GB LRDDR4 3200)
  • 178.11W@12V (D-2796TE with 512GB LRDDR4 3200)
  • 178.11W@12V (D-2796TE with 512GB LRDDR4 3200)
  • 178.11W@12V (D-2796TE with 512GB LRDDR4 3200)
  • 178.11W@12V (D-2796TE with 512GB LRDDR4 3200)
  • 178.11W@12V (D-2796TE with 512GB LRDDR4 3200)
  • 178.11W@12V (D-2796TE with 512GB LRDDR4 3200)
Power Consumption (Idle)
  • 71.06W@12V (D-2796TE with 512GB LRDDR4 3200)
  • 71.06W@12V (D-2796TE with 512GB LRDDR4 3200)
  • 71.06W@12V (D-2796TE with 512GB LRDDR4 3200)
  • 71.06W@12V (D-2796TE with 512GB LRDDR4 3200)
  • 71.06W@12V (D-2796TE with 512GB LRDDR4 3200)
  • 71.06W@12V (D-2796TE with 512GB LRDDR4 3200)
  • 71.06W@12V (D-2796TE with 512GB LRDDR4 3200)
  • 71.06W@12V (D-2796TE with 512GB LRDDR4 3200)
Environment
Operational Temperature
  • 0 ~ 60 °C (32 ~ 140 °F), Extend: -40 ~ 85° C (-40 ~ 185° F)
  • 0 ~ 60 °C (32 ~ 140 °F), Extend: -40 ~ 85° C (-40 ~ 185° F)
  • 0 ~ 60 °C (32 ~ 140 °F), Extend: -40 ~ 85° C (-40 ~ 185° F)
  • 0 ~ 60 °C (32 ~ 140 °F), Extend: -40 ~ 85° C (-40 ~ 185° F)
  • 0 ~ 60 °C (32 ~ 140 °F), Extend: -40 ~ 85° C (-40 ~ 185° F)
  • -40° C ~ 85° C
  • -40° C ~ 85° C
  • -40° C ~ 85° C
Humidity
  • Operating: 40° C @ 95% relative humidity, non-condensing; Storage: 60° C @ 95%relative humidity, non-condensing
  • Operating: 40° C @ 95% relative humidity, non-condensing; Storage: 60° C @ 95%relative humidity, non-condensing
  • Operating: 40° C @ 95% relative humidity, non-condensing; Storage: 60° C @ 95%relative humidity, non-condensing
  • Operating: 40° C @ 95% relative humidity, non-condensing; Storage: 60° C @ 95%relative humidity, non-condensing
  • Operating: 40° C @ 95% relative humidity, non-condensing; Storage: 60° C @ 95%relative humidity, non-condensing
  • Operating: 40° C @ 95% relative humidity, non-condensing; Storage: 60° C @ 95%relative humidity, non-condensing
  • Operating: 40° C @ 95% relative humidity, non-condensing; Storage: 60° C @ 95%relative humidity, non-condensing
  • Operating: 40° C @ 95% relative humidity, non-condensing; Storage: 60° C @ 95%relative humidity, non-condensing
Storage Temperature
  • - 40 ~ 85° C (-40 ~185° F)
  • - 40 ~ 85° C (-40 ~185° F)
  • - 40 ~ 85° C (-40 ~185° F)
  • - 40 ~ 85° C (-40 ~185° F)
  • - 40 ~ 85° C (-40 ~185° F)
  • - 40 ~ 85° C (-40 ~185° F)
  • - 40 ~ 85° C (-40 ~185° F)
  • - 40 ~ 85° C (-40 ~185° F)
Vibration Resistance
  • 3.5 Grm
  • 3.5 Grm
  • 3.5 Grm
  • 3.5 Grm
  • 3.5 Grm
  • 3.5 Grm
  • 3.5 Grm
  • 3.5 Grm
Mechanical
Dimensions
  • 160 x 160 mm
  • 160 x 160 mm
  • 160 x 160 mm
  • 160 x 160 mm
  • 160 x 160 mm
  • 160 x 160 mm
  • 160 x 160 mm
  • 160 x 160 mm

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