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AI Computer Systems

MIC-733-AO

AI System Based on NVIDIA® Jetson AGX Orin™

  • Compact fanless design
  • Embedded with NVIDIA® Jetson AGX Orin™ up to 275 TOPS
  • Supports 4 x GbE (optional PoE), 4 x USB 3.2 Gen 2 (10 Gbit/s)
  • Supports 2 x mPCIe, 2 x Nano SIM slots
  • Supports Allxon 24/7 remote monitoring and OTA deployment; Azure Certified Devices

Certifications:

Support Links:

Datasheet Download 3D Model Technical Downloads
  • AI System Based on NVIDIA® Jetson AGX Orin™

Specifications

Processor System
NVIDIA Jetson Series
  • AGX Orin 32G
  • AGX Orin 64G
  • AGX Orin 32G
  • AGX Orin 32G
  • AGX Orin 32G
CPU
  • 8-core NVIDIA Arm® Cortex A78AE v8.2
    64-bit CPU, 2MB L2 + 4MB L3
  • 12-core NVIDIA Arm® Cortex A78AE v8.2
    64-bit CPU, 3MB L2 + 6MB L3
  • 8-core NVIDIA Arm® Cortex A78AE v8.2
    64-bit CPU, 2MB L2 + 4MB L3
  • 8-core NVIDIA Arm® Cortex A78AE v8.2
    64-bit CPU, 2MB L2 + 4MB L3
  • 8-core NVIDIA Arm® Cortex A78AE v8.2
    64-bit CPU, 2MB L2 + 4MB L3
GPU
  • 1792-core NVIDIA Ampere GPU with 56 Tensor
    Cores, Maximum Operating Frequency: 930 MHz
  • 2048-core NVIDIA Ampere GPU with 64 Tensor
    Cores] Maximum Operating Frequency: 1.3GH
  • 1792-core NVIDIA Ampere GPU with 56 Tensor
    Cores, Maximum Operating Frequency: 930 MHz
  • 1792-core NVIDIA Ampere GPU with 56 Tensor
    Cores, Maximum Operating Frequency: 930 MHz
  • 1792-core NVIDIA Ampere GPU with 56 Tensor
    Cores, Maximum Operating Frequency: 930 MHz
Al Performance Reference
  • Up to 200 TOPs
  • Up to 275 TOPs
  • Up to 200 TOPs
  • Up to 200 TOPs
  • Up to 200 TOPs
Memory
  • 32GB 256-bit LPDDR5 DRAM
  • 64GB 256-bit LPDDR5 DRAM
  • 32GB 256-bit LPDDR5 DRAM
  • 32GB 256-bit LPDDR5 DRAM
  • 32GB 256-bit LPDDR5 DRAM
I/O
Ethernet
  • 4 x 10/100/1000 Mbps (Optional PoE support, IEEE 802.3af/at)
  • 4 x 10/100/1000 Mbps (Optional PoE support, IEEE 802.3af/at)
  • 4 x 10/100/1000 Mbps (Optional PoE support, IEEE 802.3af/at)
  • 4 x 10/100/1000 Mbps (Optional PoE support, IEEE 802.3af/at)
  • 4 x 10/100/1000 Mbps (Optional PoE support, IEEE 802.3af/at)
Display
  • HDMI (Max. resolution 3840x2160 @ 60Hz)
  • HDMI (Max. resolution 3840x2160 @ 60Hz)
  • HDMI (Max. resolution 3840x2160 @ 60Hz)
  • HDMI (Max. resolution 3840x2160 @ 60Hz)
  • HDMI (Max. resolution 3840x2160 @ 60Hz)
USB
  • External: 2 x USB 3.2 Gen 2, 1 x USB 2.0
    Internal: 1 x USB 2.0 (by pin header)
  • External: 2 x USB 3.2 Gen 2, 1 x USB 2.0
    Internal: 1 x USB 2.0 (by pin header)
  • External: 2 x USB 3.2 Gen 2, 1 x USB 2.0
    Internal: 1 x USB 2.0 (by pin header)
  • External: 2 x USB 3.2 Gen 2, 1 x USB 2.0
    Internal: 1 x USB 2.0 (by pin header)
  • External: 2 x USB 3.2 Gen 2, 1 x USB 2.0
    Internal: 1 x USB 2.0 (by pin header)
Digital I/O
  • 4-ch DI, 4-ch DO
  • 4-ch DI, 4-ch DO
  • 4-ch DI, 4-ch DO
  • 4-ch DI, 4-ch DO
  • 4-ch DI, 4-ch DO
Power Switch
  • 1 x Power ON/OFF Button
  • 1 x Power ON/OFF Button
  • 1 x Power ON/OFF Button
  • 1 x Power ON/OFF Button
  • 1 x Power ON/OFF Button
Serial Port
  • 2 x RS-232/422/485 (On-board pin header)
  • 2 x RS-232/422/485 (On-board pin header)
  • 2 x RS-232/422/485 (On-board pin header)
  • 2 x RS-232/422/485 (On-board pin header)
  • 2 x RS-232/422/485 (On-board pin header)
OTG USB
  • 1 x Micro USB
  • 1 x Micro USB
  • 1 x Micro USB
  • 1 x Micro USB
  • 1 x Micro USB
Expansion
iModule (Optional)
  • 1 x PCIe x8 (MIC-75M10-00A2)
  • 1 x PCIe x8 (MIC-75M10-00A2)
  • 1 x PCIe x8 (MIC-75M10-00A2)
  • 1 x PCIe x8 (MIC-75M10-00A2)
  • 1 x PCIe x8 (MIC-75M10-00A2)
Expansion
Mini PCIe
  • 1 x mPCIe (Signal: PCIe + USB 2.0)
  • 1 x mPCIe (Signal: PCIe + USB 2.0)
  • 1 x mPCIe (Signal: PCIe + USB 2.0)
  • 1 x mPCIe (Signal: PCIe + USB 2.0)
  • 1 x mPCIe (Signal: PCIe + USB 2.0)
SIM
  • 2 x Nano SIM slots
  • 2 x Nano SIM slots
  • 2 x Nano SIM slots
  • 2 x Nano SIM slots
  • 2 x Nano SIM slots
M.2
  • 1 x M.2 3052 (B-Key, Signal: USB)
  • 1 x M.2 3052 (B-Key, Signal: USB)
  • 1 x M.2 3052 (B-Key, Signal: USB)
  • 1 x M.2 3052 (B-Key, Signal: USB)
  • 1 x M.2 3052 (B-Key, Signal: USB)
GMSL
  • 2-ch GMSL2.0 with FAKRA connectorsV
  • 2-ch GMSL2.0 with FAKRA connectorsV
  • 2-ch GMSL2.0 with FAKRA connectorsV
  • 2-ch GMSL2.0 with FAKRA connectorsV
  • 2-ch GMSL2.0 with FAKRA connectorsV
Storage
M.2
  • 1 x M.2 2280 (M-Key, NVMe, Signal: PCIe x4)
  • 1 x M.2 2280 (M-Key, NVMe, Signal: PCIe x4)
  • 1 x M.2 2280 (M-Key, NVMe, Signal: PCIe x4)
  • 1 x M.2 2280 (M-Key, NVMe, Signal: PCIe x4)
  • 1 x M.2 2280 (M-Key, NVMe, Signal: PCIe x4)
SD Card
  • 1 x Micro SD
  • 1 x Micro SD
  • 1 x Micro SD
  • 1 x Micro SD
  • 1 x Micro SD
Power
Mode
  • AT/ATX (Default AT)
  • AT/ATX (Default AT)
  • AT/ATX (Default AT)
  • AT/ATX (Default AT)
  • AT/ATX (Default AT)
Input
  • 9 ~ 36 VDC, 16-4A
  • 9 ~ 36 VDC, 16-4A
  • 9 ~ 36 VDC, 16-4A
  • 9 ~ 36 VDC, 16-4A
  • 9 ~ 36 VDC, 16-4A
Environment
Operating Temperature
  • -10 ~ +60 °C with 0.7 m/s airflow (MaxN mode)
  • -10 ~ +60 °C with 0.7 m/s airflow (MaxN mode)
  • -10 ~ +60 °C with 0.7 m/s airflow (MaxN mode)
  • -10 ~ +60 °C with 0.7 m/s airflow (MaxN mode)
  • -10 ~ +60 °C with 0.7 m/s airflow (MaxN mode)
Operating Humidity
  • 95% @ 40 °C (non-condensing)
  • 95% @ 40 °C (non-condensing)
  • 95% @ 40 °C (non-condensing)
  • 95% @ 40 °C (non-condensing)
  • 95% @ 40 °C (non-condensing)
Vibration
  • 3 Grms @ 5 ~ 500 Hz, random, 1 hr/axis
  • 3 Grms @ 5 ~ 500 Hz, random, 1 hr/axis
  • 3 Grms @ 5 ~ 500 Hz, random, 1 hr/axis
  • 3 Grms @ 5 ~ 500 Hz, random, 1 hr/axis
  • 3 Grms @ 5 ~ 500 Hz, random, 1 hr/axis
Shock
  • 10G / 11ms
  • 10G / 11ms
  • 10G / 11ms
  • 10G / 11ms
  • 10G / 11ms
Mechanical
Dimension (W x H x D)
  • Core Module: 192 x 230 x 87 mm (7.55" x 9.05" x 3.43")
    Plus MIC-75M10: 192 x 230 x 111 mm (7.55" x 9.05" x 4.37")
  • Core Module: 192 x 230 x 87 mm (7.55" x 9.05" x 3.43")
    Plus MIC-75M10: 192 x 230 x 111 mm (7.55" x 9.05" x 4.37")
  • Core Module: 192 x 230 x 87 mm (7.55" x 9.05" x 3.43")
    Plus MIC-75M10: 192 x 230 x 111 mm (7.55" x 9.05" x 4.37")
  • Core Module: 192 x 230 x 87 mm (7.55" x 9.05" x 3.43")
    Plus MIC-75M10: 192 x 230 x 111 mm (7.55" x 9.05" x 4.37")
  • Core Module: 192 x 230 x 87 mm (7.55" x 9.05" x 3.43")
    Plus MIC-75M10: 192 x 230 x 111 mm (7.55" x 9.05" x 4.37")
Weight
  • 4.5 kg (9.9 lb)
  • 4.5 kg (9.9 lb)
  • 4.5 kg (9.9 lb)
  • 4.5 kg (9.9 lb)
  • 4.5 kg (9.9 lb)
Installation
  • Desktop / Wall mount
  • Desktop / Wall mount
  • Desktop / Wall mount
  • Desktop / Wall mount
  • Desktop / Wall mount
BSP
Jetpack
  • Above 5.0
  • Above 5.0
  • Above 5.0
  • Above 5.0
  • Above 5.0
Certification
EMC, Safety
  • CB/UL/CE/FCC/BSMI/CCC (No RED certification)
  • CB/UL/CE/FCC/BSMI/CCC (No RED certification)
  • CB/UL/CE/FCC/BSMI/CCC (No RED certification)
  • CB/UL/CE/FCC/BSMI/CCC (No RED certification)
  • CB/UL/CE/FCC/BSMI/CCC (No RED certification)

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