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  2. Placas Integradas & Servicios Design-in /
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  5. Módulos de Extensión MI/O /

Módulos de Extensión MI/O

MIOe-M2LAN

M.2 3052 extension board to Dual 2.5GbE LAN ports

  • Utilize M.2 3052 slot for LAN port extension
  • Main Board: M.2 3052 with B+M Key and PCIe x1
  • Support Dual 2.5GbE from Intel i226
  • Optional Support PoE with MIOe-PSE (Power Module)
  • PoE follow IEEE 802.3 af, support 15.4W / per port
  • Support -40~85°C extend temp. operating

Enlaces de soporte:

Ficha técnica Download 3D Model Descargas Técnicas
  • M.2 3052 extension board to Dual 2.5GbE LAN ports

Especificaciones

Ethernet
Controller
  • 2x Intel® I226
  • 2x Intel® I226
Speed
  • Up to 2.5GbE
  • Up to 2.5GbE
PoE
  • Optional Support with MIOe-PSE (IEEE 802.3 af, support 15.4W / per port)
  • Optional Support with MIOe-PSE (IEEE 802.3 af, support 15.4W / per port)
Environment
Operational Temperature
  • 0 ~ 60° C w/ 0.7m/s airflow
  • -40~85C (-40~185° F)
Storage Temperature
  • -40 ~ 85° C (-40 ~ 185° F)
  • -40 ~ 85° C (-40 ~ 185° F)
Humidity
  • Operating: 40° C @ 95% relative humidity, non-condensing; Storage: 60° C @ 95%relative humidity, non-condensing
  • Operating: 40° C @ 95% relative humidity, non-condensing; Storage: 60° C @ 95%relative humidity, non-condensing
Vibration Resistance
  • 3.5 Grms
  • 3.5 Grms
Certification
EMC
  • CE, FCC Class B
  • CE, FCC Class B
Software Support
Microsoft Windows
  • Windows Win11 LTSC
  • Windows Win11 LTSC
Compatibility
Compatible SBC
  • MIO-5377, MIO-5377R, MIO-2364 with Default BOM ; MIO-5154, MIO-5354, MIO-5376, AFE-E350, AFE-R360, ASR-A502 with BOM option by request.
  • MIO-5377, MIO-5377R, MIO-2364 with Default BOM ; MIO-5154, MIO-5354, MIO-5376, AFE-E350, AFE-R360, ASR-A502 with BOM option by request.

Características y beneficios

Meeting Diverse Needs with Minimal Deployment Effort

Meeting Diverse Needs with Minimal Deployment Effort

When integrated with Advantech single board computers, these extension modules provide extensive functionality, streamline system development, and ensure consistent future-ready designs — all without taking up extra space! 

  • Maximize Design Flexibility 
  • Standard Interface Technology 
  • Accelerate Time-to-Market

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