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AIMB-788

LGA1700 12th/13th/14th Generation Intel® Core™ i9/i7/i5/i3 ATX Motherboard with DP/HDMI/VGA, DDR4, USB 3.2, M.2

  • Intel® 12th/13th/14th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with Q670E chipset
  • Four DIMM sockets up to 128 GB DDR4 3200
  • Triple display DP/HDMI/VGA and dual GbE LAN
  • M.2, SATA RAID 0, 1, 5, 10, USB 3.2 Gen 2
  • Advantech iBMC remote out-of-band power management solution on DeviceOn
  • AWS (Amazon Web Service) IoT Greengrass qualified
  • Note 1: Legacy platform is not supported
  • Note 2: dTPM 2.0 module is required to enable Intel vPro and TPM technologies
  • Note 3: Intel® Platform Trust Technology (Intel® PTT) ready for Windows 11

Certificaciones:

Especificaciones

Processor System
CPU
  • Intel® Core™ processors (14th/13th/12th Gen)
Socket Q'ty
  • 1 x LGA1700
Core Number
  • Up to 24
L3 Cache
  • Up to 36 MB
Base Frequency
  • Up to 3.6 GHz
Chipset
  • Intel® Q670E
BIOS
  • AMI 256 Mbit SPI Flash
Expansion Interface
PCI Express x 16
  • 1
PCI Express x 8
  • -
PCI Express x 4
  • 4 (Gen 3)
PCI Express x 1
  • -
PCI
  • 2
LAN
Interface
  • 10/100/1000 Mbps
Connector
  • 2 x RJ45
Rear I/O Interface
VGA
  • 1
HDMI
  • 1
Display
  • 1
Ethernet
  • 2
USB
  • 14 (6 USB 3.2 and 8 USB 2.0)
Audio
  • 2 (Mic-in, Line-out)
Serial
  • 6
WatchDog Timer
Output
  • System Reset
Interval
  • Programmable 1~255 sec
Memory
Type and Speed
  • Dual-channel DDR4 3200 MHz (non-ECC)
System Max Capacity
  • 128 GB
Slots
  • 4 x 288-pin DIMM
Environment
Operating Temperature
  • 0 ~ 60 °C (32 ~ 140 °F)
Non-Operational Temperature
  • -40 ~ 85 °C
Operating Humidity
  • 95% @ 40 °C (Non-condensing)
Non-Operating Humidity (Non-condensing)
  • 95% @ 60 °C
Physical Characteristics
Dimension (L x H)
  • 304.8 x 244 mm (12" x 9.6")