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Panel Controllers

AMAX-PT400

Arm® Cortex®-A53 Quad-core Panel Controller

  • Optimized Linux OS for real-time control
  • Achieve 16-axis motion control with 2ms EtherCAT cycle time
  • OPC UA and Modbus TCP/RTU for IT connectivity enabled by CODESYS
  • EtherCAT, and CANopen for OT connectivity enabled by CODESYS
  • Unlimited I/O points, fieldbus networks, and visualization variables for CODESYS applications
  • CODESYS Visualization (Target & Web), SoftMotion and CNC/Robotics support provided by different packages
  • Advantech Data Connect (ADC) Library provides flexible and highly efficient data connection with 3rd party application software through symbols (PLC Handler) and shared memory (C++/C#)
  • NXP Arm® Cortex®-A53 i.MX 8M Mini quad-core processor
  • 7" and 10.1" LCD with multi-touch P-CAP and true-flat IP66-rated front panel

Certificaciones:

Enlaces de soporte:

Ficha técnica Descargas Técnicas
  • Arm® Cortex®-A53 Quad-core Panel Controller

Especificaciones

Touchscreen
Touch Type
  • PCAP
  • PCAP
  • PCAP
  • PCAP
  • PCAP
  • PCAP
  • PCAP
  • PCAP
LCD Display
Display Size
  • 7"
  • 7"
  • 7"
  • 7"
  • 10.1"
  • 10.1"
  • 10.1"
  • 10.1"
Max. Resolution
  • 1024 x 600
  • 1024 x 600
  • 1024 x 600
  • 1024 x 600
  • 1280 x 800
  • 1280 x 800
  • 1280 x 800
  • 1280 x 800
Luminance (cd/m2)
  • 425
  • 425
  • 425
  • 425
  • 500
  • 500
  • 500
  • 500
Backlight Life (hrs)
  • 50,000
  • 50,000
  • 50,000
  • 50,000
  • 50,000
  • 50,000
  • 50,000
  • 50,000
Hardware
CPU
  • NXP® ARM® Cortex™ A53 i.MX8M 1.6 GHz Quad-Core
  • NXP® ARM® Cortex™ A53 i.MX8M 1.6 GHz Quad-Core
  • NXP® ARM® Cortex™ A53 i.MX8M 1.6 GHz Quad-Core
  • NXP® ARM® Cortex™ A53 i.MX8M 1.6 GHz Quad-Core
  • NXP® ARM® Cortex™ A53 i.MX8M 1.6 GHz Quad-Core
  • NXP® ARM® Cortex™ A53 i.MX8M 1.6 GHz Quad-Core
  • NXP® ARM® Cortex™ A53 i.MX8M 1.6 GHz Quad-Core
  • NXP® ARM® Cortex™ A53 i.MX8M 1.6 GHz Quad-Core
Memory
  • 1 x LPDDR4 with 4 GB
  • 1 x LPDDR4 with 4 GB
  • 1 x LPDDR4 with 4 GB
  • 1 x LPDDR4 with 4 GB
  • 1 x LPDDR4 with 4 GB
  • 1 x LPDDR4 with 4 GB
  • 1 x LPDDR4 with 4 GB
  • 1 x LPDDR4 with 4 GB
Storage
  • 1 x eMMC (16 GB), 1 x micro SD Slot
  • 1 x eMMC (16 GB), 1 x micro SD Slot
  • 1 x eMMC (16 GB), 1 x micro SD Slot
  • 1 x eMMC (16 GB), 1 x micro SD Slot
  • 1 x eMMC (16 GB), 1 x micro SD Slot
  • 1 x eMMC (16 GB), 1 x micro SD Slot
  • 1 x eMMC (16 GB), 1 x micro SD Slot
  • 1 x eMMC (16 GB), 1 x micro SD Slot
Expansion
  • 1 x M.2 E Key 2230
  • 1 x M.2 E Key 2230
  • 1 x M.2 E Key 2230
  • 1 x M.2 E Key 2230
  • 1 x M.2 E Key 2230
  • 1 x M.2 E Key 2230
  • 1 x M.2 E Key 2230
  • 1 x M.2 E Key 2230
Certification
  • CB, UL, CE, FCC Class A, CCC, BSMI
  • CB, UL, CE, FCC Class A, CCC, BSMI
  • CB, UL, CE, FCC Class A, CCC, BSMI
  • CB, UL, CE, FCC Class A, CCC, BSMI
  • CB, UL, CE, FCC Class A, CCC, BSMI
  • CB, UL, CE, FCC Class A, CCC, BSMI
  • CB, UL, CE, FCC Class A, CCC, BSMI
  • CB, UL, CE, FCC Class A, CCC, BSMI
OS Support
  • Android, Linux
  • Android, Linux
  • Android, Linux
  • Android, Linux
  • Android, Linux
  • Android, Linux
  • Android, Linux
  • Android, Linux
Power Input
  • 24 VDC ±20%
  • 24 VDC ±20%
  • 24 VDC ±20%
  • 24 VDC ±20%
  • 24 VDC ±20%
  • 24 VDC ±20%
  • 24 VDC ±20%
  • 24 VDC ±20%
I/O Interface
USB Ports
  • 2 x USB 2.0
  • 2 x USB 2.0
  • 2 x USB 2.0
  • 2 x USB 2.0
  • 2 x USB 2.0
  • 2 x USB 2.0
  • 2 x USB 2.0
  • 2 x USB 2.0
LAN Ports
  • 2 x 10/100/1000 Mbps
  • 2 x 10/100/1000 Mbps
  • 2 x 10/100/1000 Mbps
  • 2 x 10/100/1000 Mbps
  • 2 x 10/100/1000 Mbps
  • 2 x 10/100/1000 Mbps
  • 2 x 10/100/1000 Mbps
  • 2 x 10/100/1000 Mbps
Serial Ports
  • 1xRS-232/422/485,1xRS-485/Canbus
  • 1xRS-232/422/485,1xRS-485/Canbus
  • 1xRS-232/422/485,1xRS-485/Canbus
  • 1xRS-232/422/485,1xRS-485/Canbus
  • 1xRS-232/422/485,1xRS-485/Canbus
  • 1xRS-232/422/485,1xRS-485/Canbus
  • 1xRS-232/422/485,1xRS-485/Canbus
  • 1xRS-232/422/485,1xRS-485/Canbus
Mechanical
Enclosure
  • Die cast magnesium alloy, Die-casting aluminum
  • Die cast magnesium alloy, Die-casting aluminum
  • Die cast magnesium alloy, Die-casting aluminum
  • Die cast magnesium alloy, Die-casting aluminum
  • Die cast magnesium alloy, Die-casting aluminum
  • Die cast magnesium alloy, Die-casting aluminum
  • Die cast magnesium alloy, Die-casting aluminum
  • Die cast magnesium alloy, Die-casting aluminum
Mounting
  • VESA, Panel
  • VESA, Panel
  • VESA, Panel
  • VESA, Panel
  • VESA, Panel
  • VESA, Panel
  • VESA, Panel
  • VESA, Panel
Weight (Net)
  • 2 kg (4.41 lb)
  • 2 kg (4.41 lb)
  • 2 kg (4.41 lb)
  • 2 kg (4.41 lb)
  • 4 kg
  • 4 kg
  • 4 kg
  • 4 kg
Environment
Ingress Protection
  • Front Panel IP66
  • Front Panel IP66
  • Front Panel IP66
  • Front Panel IP66
  • Front Panel IP66
  • Front Panel IP66
  • Front Panel IP66
  • Front Panel IP66
Operating Temperature
  • -20~60 °C (-4~140 °F)
  • -20~60 °C (-4~140 °F)
  • -20~60 °C (-4~140 °F)
  • -20~60 °C (-4~140 °F)
  • -20~60 °C (-4~140 °F)
  • -20~60 °C (-4~140 °F)
  • -20~60 °C (-4~140 °F)
  • -20~60 °C (-4~140 °F)
Storage Temperature
  • -30~70 °C (-22~158 °F)
  • -30~70 °C (-22~158 °F)
  • -30~70 °C (-22~158 °F)
  • -30~70 °C (-22~158 °F)
  • -30~70 °C (-22~158 °F)
  • -30~70 °C (-22~158 °F)
  • -30~70 °C (-22~158 °F)
  • -30~70 °C (-22~158 °F)
Relative Humidity
  • 95% RH (non-condensing)
  • 95% RH (non-condensing)
  • 95% RH (non-condensing)
  • 95% RH (non-condensing)
  • 95% RH (non-condensing)
  • 95% RH (non-condensing)
  • 95% RH (non-condensing)
  • 95% RH (non-condensing)
Shock Protection
  • 10 G, half sine
  • 10 G, half sine
  • 10 G, half sine
  • 10 G, half sine
  • 10 G, half sine
  • 10 G, half sine
  • 10 G, half sine
  • 10 G, half sine
Vibration Protection
  • 2 Grms, random
  • 2 Grms, random
  • 2 Grms, random
  • 2 Grms, random
  • 2 Grms, random
  • 2 Grms, random
  • 2 Grms, random
  • 2 Grms, random
Isolation Protection
  • Chassis grounding protection
  • Chassis grounding protection
  • Chassis grounding protection
  • Chassis grounding protection
  • Chassis grounding protection
  • Chassis grounding protection
  • Chassis grounding protection
  • Chassis grounding protection

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