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  1. Inicio /
  2. Embedded Computing /
  3. Industrial Wireless Solutions /
  4. AIW 300 Series (4G LTE/5G NR) /

AIW 300 Series (4G LTE/5G NR)

AIW-356

5G NR FR1 module, M.2 3052 B-Key form factor, USB interface

  • Main Chipset Qualcomm SDX62
  • Max DL peak rate 3.2 Gbps NR Sub6 EN-DC, Max UL peak rate of 900Mbps
  • UL Max support 2 MIMO, DL Max support 4 MIMO
  • M.2 3052 form factor, USB interface
  • Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F)
  • AIW-356 DQ-N01: 5G NR FR1 module, USB communication interface, with GNSS, for US
  • AIW-356 DQ-E01: 5G NR FR1 module, USB communication interface, with GNSS, for EU, for Australia
  • AIW-356 DQ-JK1: 5G NR FR1 module, USB communication interface, with GNSS, for Japan, for South Korea
  • AIW-356 DQ-C01: 5G NR FR1 module, USB communication interface, with GNSS, for China

Certificaciones:

Enlaces de soporte:

Ficha técnica Descargas Técnicas
  • 5G NR FR1 module, M.2 3052 B-Key form factor, USB interface

Especificaciones

Cellular
5G
  • Sub 6
  • Sub 6
  • Sub 6
  • Sub 6
Main Chipset
  • Qualcom SDX62
  • Qualcom SDX62
  • Qualcom SDX62
  • Qualcom SDX62
size
  • M.2 3052 Key-B
  • M.2 3052 Key-B
  • M.2 3052 Key-B
  • M.2 3052 Key-B
SIM slot
  • without SIM solt
  • without SIM solt
  • without SIM solt
  • without SIM solt
Downlink/ Uplink
  • 3.2 Gbps/ 900Mbps
  • 3.2 Gbps/ 900Mbps
  • 3.2 Gbps/ 900Mbps
  • 3.2 Gbps/ 900Mbps
Operating Temperature
  • -40 to +85°C
  • -40 to +85°C
  • -40 to +85°C
  • -40 to +85°C

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